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Bare PCB and PCBA ssembling factory

HomeUncategorizedHTC electronics company, your eyes in factories in Asia, one-stop service for PCB becomes a much simpler!

HTC electronics company, your eyes in factories in Asia, one-stop service for PCB becomes a much simpler!

Supported by contact manufacture which cooperated with HTG over than 10 years, HTG could offer clients rigid board, flexiable board, single-sided, double-sided, multilayer board, support PCB design, sample and production, full service for all our clients.

PCB production equipment

Manufacturing tools-1 Manufacturing tools-PCB-2 PCB Manufacturing tools-3  PCB Manufacturing tools-5

Contract PCBA factroy It has a standard workshop of 20,000 square meters, and a staff of nearly 1500 , It built 12 high speed SMT production lines and 2 assembly lines. All our products meet the ROHS requirements of European Union.

PCB assembly shop

PCBA ssembling factory PCBA ssembling factory PCBA ssembling factory PCBA ssembling factory

PCB products

4-layer board impedance Bluetooth2-layer printed circuit board       6-layer board impedance Bluetooth     10-layer printed circuit board16 layer GoldfingerPCB  Thick copper printed circuit boards Immersion Gold HDI printed circuit board-2 Gold finger PCB HDI printed circuit board-1 Copper base PCB Aluminum PCBDouble-sided high frequency boardHigh frequency board

Process Capability:

  • Product type: single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.
  • The maximum number of layers: 24 layers
  • Processing Board Thickness: 0.2mm -8.0mm rigid plate flexible plate 0.025mm — 0.2mm
  • copper foil substrate thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
  • finished the smallest aperture 0.15MM
  • wire width: the minimum line width: gold plate 0.071mm, 0.075mm tin plate
  • wire spacing: Minimum spacing: gold plate 0.071mm, 0.075mm tin plate
  • gold plate: Nickel layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or customer requirements
  • HASL: tin layer thickness:> or = 2.5-5μ
  • paneling: wire-to-edge minimum distance: 0.15mm hole to the edge minimum distance: 0.2mm smallest form tolerance: ± 0.12mm
  • outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm
  • V Cutting: Angle: 30 degrees, 35 degrees, 45 degrees Depth: Minimum thickness 2/3 Size: 80mm * 80mm
  • off test:
  • the maximum test area: 640mm * 1100mm
  • Maximum test point: 8000
  • the maximum test voltage: 300V
  • Maximum Insulation Resistance: 100M Europe

Soldering resistance: 85 — 105 ℃ / 280 ℃ — 360 ℃.

https://www.htgelec.comprintedcircuitboard/

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